FX-700-LAF-GNK-D5-J6
vs
SY88953LMITR
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MICROSEMI CORP
MICREL INC
Package Description
SMD-16
HVQCCN, LCC16,.12SQ,20
Reach Compliance Code
unknown
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-CQCC-N16
S-XQCC-N16
JESD-609 Code
e4
e0
Length
7.49 mm
3 mm
Moisture Sensitivity Level
1
2
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
UNSPECIFIED
Package Code
QCCN
HVQCCN
Package Shape
RECTANGULAR
SQUARE
Package Style
CHIP CARRIER
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
260
240
Seated Height-Max
2.13 mm
0.9 mm
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Telecom IC Type
ATM/SONET/SDH SUPPORT CIRCUIT
ATM/SONET/SDH SUPPORT CIRCUIT
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
GOLD OVER NICKEL
Tin/Lead (Sn85Pb15)
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
1.02 mm
0.5 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
15
30
Width
5.08 mm
3 mm
Base Number Matches
3
2
Rohs Code
Part Package Code
QFN
Pin Count
16
Applications
SDH; SONET
Package Equivalence Code
LCC16,.12SQ,20
Qualification Status
Not Qualified
Supply Current-Max
0.17 mA
Technology
BIPOLAR
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