FX-700-LAF-GNK-D5-J6
vs
M02043-15
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MINDSPEED TECHNOLOGIES INC
|
Package Description |
QCCN,
|
HVQCCN, LCC16,.12SQ,20
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Applications |
ATM; SDH; SONET
|
SDH; SONET
|
JESD-30 Code |
R-CQCC-N16
|
S-XQCC-N16
|
JESD-609 Code |
e4
|
e0
|
Length |
7.49 mm
|
3 mm
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
UNSPECIFIED
|
Package Code |
QCCN
|
HVQCCN
|
Package Equivalence Code |
LCC16,.2X.3,40
|
LCC16,.12SQ,20
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
|
Seated Height-Max |
2.13 mm
|
0.9 mm
|
Supply Current-Max |
40 mA
|
0.042 mA
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
ATM/SONET/SDH SUPPORT CIRCUIT
|
ATM/SONET/SDH SUPPORT CIRCUIT
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
GOLD OVER NICKEL
|
TIN LEAD
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
1.02 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
15
|
|
Width |
5.08 mm
|
3 mm
|
Base Number Matches |
1
|
2
|
Rohs Code |
|
No
|
Part Package Code |
|
QFN
|
Pin Count |
|
16
|
Qualification Status |
|
Not Qualified
|
|
|
|
Compare FX-700-LAF-GNK-D5-J6 with alternatives
Compare M02043-15 with alternatives