FT6164L-25DWM
vs
MT5C6405EC-70/IT
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
FORCE TECHNOLOGIES LTD
|
MICROSS COMPONENTS
|
| Part Package Code |
DIP
|
QLCC
|
| Package Description |
DIP,
|
QCCN,
|
| Pin Count |
28
|
28
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A001.A.2.C
|
EAR99
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
25 ns
|
70 ns
|
| Additional Feature |
LG-MAX
|
|
| JESD-30 Code |
R-GDIP-T28
|
R-CQCC-N28
|
| Length |
37.846 mm
|
13.97 mm
|
| Memory Density |
65536 bit
|
65536 bit
|
| Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
| Memory Width |
8
|
4
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
28
|
| Number of Words |
8192 words
|
16384 words
|
| Number of Words Code |
8000
|
16000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Organization |
8KX8
|
16KX4
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
QCCN
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
CHIP CARRIER
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Screening Level |
MIL-STD-883 Class B (Modified)
|
|
| Seated Height-Max |
5.8928 mm
|
1.905 mm
|
| Supply Current-Max |
0.155 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
15.24 mm
|
8.89 mm
|
| Base Number Matches |
4
|
1
|
|
|
|
Compare FT6164L-25DWM with alternatives
Compare MT5C6405EC-70/IT with alternatives