FT6164-12PILF
vs
P4C164L-12CMBLF
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
FORCE TECHNOLOGIES LTD
PYRAMID SEMICONDUCTOR CORP
Part Package Code
DIP
DIP
Package Description
,
0.300 INCH, ROHS COMPLIANT, CERAMIC, SIDE BRAZED, DIP-28
Pin Count
28
28
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
12 ns
12 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-PDIP-T28
R-CDIP-T28
Length
34.8615 mm
37.719 mm
Memory Density
65536 bit
65536 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Organization
8KX8
8KX8
Output Characteristics
3-STATE
3-STATE
Output Enable
YES
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Equivalence Code
DIP28,.3
DIP28,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Seated Height-Max
5.334 mm
5.715 mm
Standby Current-Max
0.03 A
0.0002 A
Standby Voltage-Min
2 V
2 V
Supply Current-Max
0.18 mA
0.18 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
1
1
Pbfree Code
Rohs Code
Additional Feature
LG-MAX
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Screening Level
MIL-STD-883 Class B
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare FT6164-12PILF with alternatives
Compare P4C164L-12CMBLF with alternatives