FT6164-12LMBLF
vs
P4C164-12LMBLF
feature comparison
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
FORCE TECHNOLOGIES LTD
|
PYRAMID SEMICONDUCTOR CORP
|
Package Description |
,
|
QCCN, LCC28,.35X.55
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
3A001.A.2.C
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
Part Package Code |
|
QLCC
|
Pin Count |
|
28
|
Access Time-Max |
|
12 ns
|
I/O Type |
|
COMMON
|
JESD-30 Code |
|
R-CQCC-N28
|
Length |
|
13.97 mm
|
Memory Density |
|
65536 bit
|
Memory Width |
|
8
|
Number of Functions |
|
1
|
Number of Terminals |
|
28
|
Number of Words |
|
8192 words
|
Number of Words Code |
|
8000
|
Operating Mode |
|
ASYNCHRONOUS
|
Operating Temperature-Max |
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Organization |
|
8KX8
|
Output Characteristics |
|
3-STATE
|
Package Body Material |
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
|
QCCN
|
Package Equivalence Code |
|
LCC28,.35X.55
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
CHIP CARRIER
|
Parallel/Serial |
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Qualification Status |
|
Not Qualified
|
Screening Level |
|
MIL-STD-883 Class B
|
Seated Height-Max |
|
1.905 mm
|
Standby Current-Max |
|
0.025 A
|
Standby Voltage-Min |
|
4.5 V
|
Supply Current-Max |
|
0.18 mA
|
Supply Voltage-Max (Vsup) |
|
5.5 V
|
Supply Voltage-Min (Vsup) |
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
|
5 V
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Temperature Grade |
|
MILITARY
|
Terminal Form |
|
NO LEAD
|
Terminal Pitch |
|
1.27 mm
|
Terminal Position |
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
Width |
|
8.89 mm
|
|
|
|
Compare FT6164-12LMBLF with alternatives
Compare P4C164-12LMBLF with alternatives