FT6164-12DWM
vs
P4C164-12CWMB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
FORCE TECHNOLOGIES LTD
PYRAMID SEMICONDUCTOR CORP
Package Description
,
DIP,
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Base Number Matches
1
1
Rohs Code
Part Package Code
DIP
Pin Count
28
Access Time-Max
12 ns
Additional Feature
LG-MAX
JESD-30 Code
R-CDIP-T28
Length
37.846 mm
Memory Density
65536 bit
Memory Width
8
Number of Functions
1
Number of Terminals
28
Number of Words
8192 words
Number of Words Code
8000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Organization
8KX8
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Screening Level
MIL-STD-883 Class B
Seated Height-Max
5.08 mm
Supply Current-Max
0.18 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
MILITARY
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
15.24 mm
Compare FT6164-12DWM with alternatives
Compare P4C164-12CWMB with alternatives