FT28C513JMB-12
vs
X28C513JI-12
feature comparison
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
FORCE TECHNOLOGIES LTD
|
ROCHESTER ELECTRONICS LLC
|
Part Package Code |
QFJ
|
|
Package Description |
PLASTIC, LCC-32
|
PLASTIC, LCC-32
|
Pin Count |
32
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
3A001.A.2.C
|
EAR99
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
Access Time-Max |
120 ns
|
120 ns
|
Additional Feature |
100 YEAR DATA RETENTION
|
|
Data Retention Time-Min |
100
|
|
JESD-30 Code |
R-PQCC-J32
|
R-PQCC-J32
|
Length |
13.97 mm
|
13.97 mm
|
Memory Density |
524288 bit
|
524288 bit
|
Memory IC Type |
EEPROM
|
EEPROM
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
32
|
32
|
Number of Words |
65536 words
|
65536 words
|
Number of Words Code |
64000
|
64000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-55 °C
|
-40 °C
|
Organization |
64KX8
|
64KX8
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
QCCJ
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Programming Voltage |
5 V
|
5 V
|
Qualification Status |
Not Qualified
|
|
Screening Level |
MIL-STD-883
|
|
Seated Height-Max |
3.56 mm
|
3.56 mm
|
Supply Current-Max |
0.05 mA
|
0.05 mA
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
INDUSTRIAL
|
Terminal Form |
J BEND
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Width |
11.43 mm
|
11.43 mm
|
Write Cycle Time-Max (tWC) |
10 ms
|
10 ms
|
Base Number Matches |
1
|
4
|
Rohs Code |
|
No
|
|
|
|
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