FT2232HL-REEL
vs
FT2232HL-TRAY
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD
|
FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
LFQFP, QFP64,.47SQ,20
|
LFQFP, QFP64,.47SQ,20
|
| Pin Count |
64
|
64
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Samacsys Manufacturer |
FTDI Chip
|
FTDI Chip
|
| Additional Feature |
IT ALSO OPERATES AT 3.3 V
|
IT ALSO OPERATES AT 3.3 V
|
| Address Bus Width |
16
|
16
|
| Bus Compatibility |
8048; 8051
|
8048; 8051
|
| Clock Frequency-Max |
12 MHz
|
12 MHz
|
| External Data Bus Width |
8
|
8
|
| JESD-30 Code |
S-PQFP-G64
|
S-PQFP-G64
|
| Length |
10 mm
|
10 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Terminals |
64
|
64
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFQFP
|
LFQFP
|
| Package Equivalence Code |
QFP64,.47SQ,20
|
QFP64,.47SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.6 mm
|
1.6 mm
|
| Supply Voltage-Max |
1.98 V
|
1.98 V
|
| Supply Voltage-Min |
1.62 V
|
1.62 V
|
| Supply Voltage-Nom |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| Width |
10 mm
|
10 mm
|
| uPs/uCs/Peripheral ICs Type |
BUS CONTROLLER, UNIVERSAL SERIAL BUS
|
BUS CONTROLLER, UNIVERSAL SERIAL BUS
|
| Base Number Matches |
1
|
1
|
|
|
|