FSTU3125M vs CBT3125DB,112 feature comparison

FSTU3125M Rochester Electronics LLC

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CBT3125DB,112 NXP Semiconductors

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Part Life Cycle Code Active Transferred
Ihs Manufacturer ROCHESTER ELECTRONICS INC NXP SEMICONDUCTORS
Part Package Code SOIC SSOP1
Package Description SOP, SSOP, SSOP14,.3
Pin Count 14 14
Reach Compliance Code unknown compliant
Family CBT/FST/QS/5C/B CBT/FST/QS/5C/B
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Length 8.65 mm 6.2 mm
Logic IC Type BUS DRIVER BUS DRIVER
Number of Bits 4 4
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, SHRINK PITCH
Propagation Delay (tpd) 0.25 ns 0.25 ns
Qualification Status COMMERCIAL Not Qualified
Seated Height-Max 1.75 mm 2 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL DUAL
Width 3.9 mm 5.3 mm
Base Number Matches 2 2
Rohs Code Yes
Manufacturer Package Code SOT337-1
HTS Code 8542.39.00.01
JESD-609 Code e4
Moisture Sensitivity Level 1
Package Equivalence Code SSOP14,.3
Peak Reflow Temperature (Cel) 260
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s) 30

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