FST16212MTD vs CBT16212DGG,112 feature comparison

FST16212MTD Rochester Electronics LLC

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CBT16212DGG,112 NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Contact Manufacturer Transferred
Ihs Manufacturer ROCHESTER ELECTRONICS LLC NXP SEMICONDUCTORS
Part Package Code TSSOP TSSOP
Package Description TSSOP, PLASTIC, TSSOP-56
Pin Count 56 56
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature TTL COMPATIBLE BUS SWITCH
Family CBT/FST/QS/5C/B CBT/FST/QS/5C/B
JESD-30 Code R-PDSO-G56 R-PDSO-G56
JESD-609 Code e3 e4
Length 14 mm 14 mm
Logic IC Type BUS EXCHANGER BUS EXCHANGER
Number of Bits 12 24
Number of Functions 1 1
Number of Ports 4 4
Number of Terminals 56 56
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 0.25 ns 0.25 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.2 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4 V 4 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Width 6.1 mm 6.1 mm
Base Number Matches 2 2
Manufacturer Package Code SOT364-1
Factory Lead Time 4 Weeks
Moisture Sensitivity Level 1
Package Equivalence Code TSSOP56,.3,20
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30

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