FST16211G
vs
FSTUD16211GX
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ON SEMICONDUCTOR
FAIRCHILD SEMICONDUCTOR CORP
Package Description
FBGA-54
LFBGA, BGA54,6X9,32
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
TTL COMPATIBLE BUS SWITCH
TTL COMPATIBLE BUS SWITCH
Control Type
ENABLE LOW
Family
CBT/FST/QS/5C/B
CBT/FST/QS/5C/B
JESD-30 Code
R-PBGA-B54
R-PBGA-B54
Length
8 mm
8 mm
Load Capacitance (CL)
50 pF
Logic IC Type
BUS DRIVER
BUS DRIVER
Number of Bits
12
12
Number of Functions
2
2
Number of Ports
2
2
Number of Terminals
54
54
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Equivalence Code
BGA54,6X9,32
BGA54,6X9,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Packing Method
TRAY
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Power Supply Current-Max (ICC)
0.03 mA
Propagation Delay (tpd)
0.25 ns
0.25 ns
Seated Height-Max
1.4 mm
1.4 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
5.5 mm
5.5 mm
Base Number Matches
2
1
Part Package Code
BGA
Pin Count
54
JESD-609 Code
e0
Moisture Sensitivity Level
3
Qualification Status
Not Qualified
Technology
CMOS
Terminal Finish
TIN LEAD
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