FSA3157P6X
vs
SN74LVC1G3157YZPR
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
SOIC
|
BGA
|
| Package Description |
TSSOP,
|
GREEN, DSBGA-6
|
| Pin Count |
6
|
6
|
| Reach Compliance Code |
unknown
|
unknown
|
| Additional Feature |
2:1 MULTIPLEXER/DEMULTIPLEXER BUS SWITCH
|
|
| Analog IC - Other Type |
SPDT
|
SPDT
|
| JESD-30 Code |
R-PDSO-G6
|
R-XBGA-B6
|
| JESD-609 Code |
e3
|
e1
|
| Length |
2 mm
|
1.4 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
6
|
6
|
| Off-state Isolation-Nom |
57 dB
|
57 dB
|
| On-state Resistance Match-Nom |
0.5 Ω
|
0.1 Ω
|
| On-state Resistance-Max (Ron) |
30 Ω
|
30 Ω
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
TSSOP
|
VFBGA
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
1.1 mm
|
0.5 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
1.65 V
|
1.65 V
|
| Supply Voltage-Nom (Vsup) |
2.3 V
|
2.3 V
|
| Surface Mount |
YES
|
YES
|
| Switch-off Time-Max |
7 ns
|
7.5 ns
|
| Switch-on Time-Max |
13 ns
|
14 ns
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
TIN SILVER COPPER
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.65 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Width |
1.25 mm
|
0.9 mm
|
| Base Number Matches |
3
|
2
|
|
|
|
Compare FSA3157P6X with alternatives
Compare SN74LVC1G3157YZPR with alternatives