FSA1156P6X vs FSA1156P6 feature comparison

FSA1156P6X Fairchild Semiconductor Corporation

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FSA1156P6 Rochester Electronics LLC

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer FAIRCHILD SEMICONDUCTOR CORP ROCHESTER ELECTRONICS INC
Part Package Code SC-70 SOIC
Package Description 1.25 MM, SC-70, SC-88, 6 PIN TSSOP,
Pin Count 6 6
Manufacturer Package Code 6LD,SC70,EIAJ SC-88,1.25MM WIDE
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01
Analog IC - Other Type SPST SPST
JESD-30 Code R-PDSO-G6 R-PDSO-G6
JESD-609 Code e3 e3
Length 2 mm 2 mm
Moisture Sensitivity Level 1 1
Normal Position NO
Number of Channels 1 1
Number of Functions 1 1
Number of Terminals 6 6
On-state Resistance-Max (Ron) 2.1 Ω 2.1 Ω
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP6,.08
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.65 V 1.65 V
Supply Voltage-Nom (Vsup) 2.7 V 2.7 V
Surface Mount YES YES
Switch-on Time-Max 40 ns
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 1.25 mm 1.25 mm
Base Number Matches 2 2

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