FR3G
vs
RS3G
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
SANGDEST MICROELECTRONICS (NANJING) CO LTD
|
INTERNATIONAL SEMICONDUCTOR INC
|
Package Description |
SMC, 2 PIN
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.80
|
8541.10.00.80
|
Additional Feature |
LOW LEAKAGE CURRENT
|
|
Application |
EFFICIENCY
|
FAST RECOVERY
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
Forward Voltage-Max (VF) |
1.3 V
|
|
JEDEC-95 Code |
DO-214AB
|
DO-214AB
|
JESD-30 Code |
R-PDSO-C2
|
R-PDSO-C2
|
JESD-609 Code |
e0
|
|
Moisture Sensitivity Level |
1
|
|
Non-rep Pk Forward Current-Max |
100 A
|
100 A
|
Number of Elements |
1
|
1
|
Number of Phases |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
150 °C
|
|
Operating Temperature-Min |
-55 °C
|
|
Output Current-Max |
3 A
|
3 A
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Rep Pk Reverse Voltage-Max |
400 V
|
|
Reverse Current-Max |
5 µA
|
|
Reverse Recovery Time-Max |
0.15 µs
|
0.15 µs
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
C BEND
|
C BEND
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
4
|
1
|
|
|
|
Compare FR3G with alternatives
Compare RS3G with alternatives