FQV261L7.5TF
vs
IDT72261L12PFT/R
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Contact Manufacturer
Transferred
Ihs Manufacturer
AMIC TECHNOLOGY CORP
INTEGRATED DEVICE TECHNOLOGY INC
Package Description
QFP, QFP64,.47SQ,20
14 X 14 MM, 1.40 MM HEIGHT, TQFP-64
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
5 ns
Clock Frequency-Max (fCLK)
133 MHz
Cycle Time
7.5 ns
12 ns
JESD-30 Code
S-PQFP-G64
S-PQFP-G64
Memory Density
147456 bit
147456 bit
Memory IC Type
OTHER FIFO
Memory Width
9
9
Number of Functions
1
1
Number of Terminals
64
64
Number of Words
16384 words
16384 words
Number of Words Code
16000
16000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
16KX9
16KX9
Output Enable
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QFP
LQFP
Package Equivalence Code
QFP64,.47SQ,20
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
FLATPACK, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.02 A
Supply Current-Max
0.055 mA
Supply Voltage-Nom (Vsup)
3.3 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.8 mm
Terminal Position
QUAD
QUAD
Base Number Matches
2
1
Pbfree Code
Part Package Code
QFP
Pin Count
64
Additional Feature
RETRANSMIT
JESD-609 Code
e0
Length
14 mm
Moisture Sensitivity Level
3
Output Characteristics
3-STATE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Seated Height-Max
1.6 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Terminal Finish
Tin/Lead (Sn/Pb)
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
14 mm
Compare FQV261L7.5TF with alternatives
Compare IDT72261L12PFT/R with alternatives