FQV261L10TF
vs
IDT72261L25PFB
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Contact Manufacturer
Transferred
Ihs Manufacturer
AMIC TECHNOLOGY CORP
INTEGRATED DEVICE TECHNOLOGY INC
Package Description
QFP, QFP64,.47SQ,20
TQFP-64
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
6.5 ns
Clock Frequency-Max (fCLK)
100 MHz
Cycle Time
10 ns
25 ns
JESD-30 Code
S-PQFP-G64
S-PQFP-G64
Memory Density
147456 bit
147456 bit
Memory IC Type
OTHER FIFO
Memory Width
9
9
Number of Functions
1
1
Number of Terminals
64
64
Number of Words
16384 words
16384 words
Number of Words Code
16000
16000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
16KX9
16KX9
Output Enable
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QFP
LQFP
Package Equivalence Code
QFP64,.47SQ,20
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
FLATPACK, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.02 A
Supply Current-Max
0.055 mA
Supply Voltage-Nom (Vsup)
3.3 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.8 mm
Terminal Position
QUAD
QUAD
Base Number Matches
1
1
Pbfree Code
Part Package Code
QFP
Pin Count
64
Additional Feature
RETRANSMIT
JESD-609 Code
e0
Length
14 mm
Moisture Sensitivity Level
3
Output Characteristics
3-STATE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Seated Height-Max
1.6 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Terminal Finish
Tin/Lead (Sn/Pb)
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
14 mm
Compare FQV261L10TF with alternatives
Compare IDT72261L25PFB with alternatives