FODM452
vs
TLP2309(TPL,E
feature comparison
| Pbfree Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ONSEMI
|
TOSHIBA CORP
|
| Package Description |
SOP-5
|
SOP-6/5
|
| Manufacturer Package Code |
100AM
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8541.40.80.00
|
8541.40.80.00
|
| Factory Lead Time |
17 Weeks
|
|
| Samacsys Manufacturer |
onsemi
|
Toshiba
|
| Additional Feature |
CMOS COMPATIBLE, UL RECOGNIZED
|
UL RECOGNIZED
|
| Configuration |
SINGLE
|
SINGLE
|
| Current Transfer Ratio-Min |
15%
|
|
| Data Rate-Nom |
1 MBps
|
0.125 MBps
|
| Forward Current-Max |
0.025 A
|
0.025 A
|
| Forward Voltage-Max |
1.8 V
|
|
| Isolation Voltage-Max |
3750 V
|
3750 V
|
| JESD-609 Code |
e3
|
|
| Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
| Number of Elements |
1
|
1
|
| Number of Functions |
1
|
1
|
| On-State Current-Max |
0.008 A
|
0.008 A
|
| Operating Temperature-Max |
85 °C
|
110 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Optoelectronic Device Type |
LOGIC IC OUTPUT OPTOCOUPLER
|
LOGIC IC OUTPUT OPTOCOUPLER
|
| Power Dissipation-Max |
0.1 W
|
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
|
| Base Number Matches |
4
|
3
|
| Rohs Code |
|
Yes
|
| Packing Method |
|
TR, 13 INCH
|
| Response Time-Max |
|
0.000001 s
|
| Supply Voltage-Min |
|
2.7 V
|
|
|
|
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