FOD817D
vs
HCPL-817-56DE
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ONSEMI
|
AVAGO TECHNOLOGIES INC
|
| Package Description |
DIP-4
|
0.300 INCH, ROHS COMPLIANT, SMD, DIP-4
|
| Manufacturer Package Code |
646CD
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8541.40.80.00
|
8541.40.80.00
|
| Factory Lead Time |
15 Weeks
|
|
| Samacsys Manufacturer |
onsemi
|
Avago Technologies
|
| Additional Feature |
UL APPROVED
|
UL RECOGNIZED
|
| Coll-Emtr Bkdn Voltage-Min |
70 V
|
70 V
|
| Configuration |
SINGLE
|
SINGLE
|
| Current Transfer Ratio-Min |
300%
|
50%
|
| Current Transfer Ratio-Nom |
300%
|
300%
|
| Dark Current-Max |
100 nA
|
100 nA
|
| Forward Current-Max |
0.05 A
|
0.05 A
|
| Forward Voltage-Max |
1.4 V
|
1.4 V
|
| Isolation Voltage-Max |
5000 V
|
5000 V
|
| JESD-609 Code |
e3
|
e3
|
| Mounting Feature |
THROUGH HOLE MOUNT
|
SURFACE MOUNT
|
| Number of Elements |
1
|
1
|
| On-State Current-Max |
0.05 A
|
0.03 A
|
| Operating Temperature-Max |
110 °C
|
100 °C
|
| Operating Temperature-Min |
-55 °C
|
-30 °C
|
| Optoelectronic Device Type |
TRANSISTOR OUTPUT OPTOCOUPLER
|
TRANSISTOR OUTPUT OPTOCOUPLER
|
| Packing Method |
TUBE
|
|
| Power Dissipation-Max |
0.15 W
|
0.2 W
|
| Response Time-Max |
0.000018 s
|
0.000018 s
|
| Surface Mount |
NO
|
YES
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
MATTE TIN
|
| Base Number Matches |
7
|
1
|
| Rohs Code |
|
Yes
|
|
|
|
Compare FOD817D with alternatives
Compare HCPL-817-56DE with alternatives