FLM7785-6F
vs
FLM7785-8C
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
FUJITSU SEMICONDUCTOR AMERICA INC
FUJITSU LTD
Package Description
FLANGE MOUNT, R-CDFM-F2
HERMETIC SEALED, METAL CERAMIC PACKAGE-2
Pin Count
3
2
Manufacturer Package Code
CASE IB
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
Additional Feature
HIGH RELIABILITY
HIGH RELIABILITY
Case Connection
SOURCE
SOURCE
Configuration
SINGLE
SINGLE
DS Breakdown Voltage-Min
15 V
15 V
Drain Current-Max (ID)
2.25 A
2.6 A
FET Technology
JUNCTION
JUNCTION
Highest Frequency Band
X BAND
X BAND
JESD-30 Code
R-CDFM-F2
R-CDFM-F2
Number of Elements
1
1
Number of Terminals
2
2
Operating Mode
DEPLETION MODE
DEPLETION MODE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLANGE MOUNT
FLANGE MOUNT
Polarity/Channel Type
N-CHANNEL
N-CHANNEL
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
YES
Terminal Form
FLAT
FLAT
Terminal Position
DUAL
DUAL
Transistor Element Material
GALLIUM ARSENIDE
GALLIUM ARSENIDE
Base Number Matches
1
1
HTS Code
8541.29.00.75
Power Dissipation Ambient-Max
37 W
Compare FLM7785-6F with alternatives
Compare FLM7785-8C with alternatives