FLM7785-4D
vs
FLM7785-6F
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
FUJITSU LTD
SUMITOMO ELECTRIC INDUSTRIES LTD
Package Description
HERMETIC SEALED, METAL CERAMIC PACKAGE-2
FLANGE MOUNT, R-CDFM-F2
Pin Count
2
2
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.29.00.75
Additional Feature
HIGH RELIABILITY
HIGH RELIABILITY
Case Connection
SOURCE
SOURCE
Configuration
SINGLE
SINGLE
DS Breakdown Voltage-Min
15 V
15 V
Drain Current-Max (ID)
1.3 A
2.25 A
FET Technology
JUNCTION
JUNCTION
Highest Frequency Band
X BAND
C BAND
JESD-30 Code
R-CDFM-F2
R-CDFM-F2
Number of Elements
1
1
Number of Terminals
2
2
Operating Mode
DEPLETION MODE
DEPLETION MODE
Operating Temperature-Max
175 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLANGE MOUNT
FLANGE MOUNT
Polarity/Channel Type
N-CHANNEL
N-CHANNEL
Power Dissipation Ambient-Max
25 W
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
YES
Terminal Form
FLAT
FLAT
Terminal Position
DUAL
DUAL
Transistor Element Material
GALLIUM ARSENIDE
GALLIUM ARSENIDE
Base Number Matches
2
4
Pbfree Code
Rohs Code
Manufacturer Package Code
CASE IB
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Transistor Application
AMPLIFIER
Compare FLM7785-4D with alternatives
Compare FLM7785-6F with alternatives