FLM7785-12F
vs
FLM7785-4F
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
FUJITSU SEMICONDUCTOR AMERICA INC
|
FUJITSU SEMICONDUCTOR AMERICA INC
|
Package Description |
FLANGE MOUNT, R-CDFM-F2
|
HERMETIC SEALED, METAL CERAMIC PACKAGE-2
|
Pin Count |
3
|
3
|
Manufacturer Package Code |
CASE IK
|
CASE IB
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
Additional Feature |
HIGH RELIABILITY
|
HIGH RELIABILITY
|
Case Connection |
SOURCE
|
SOURCE
|
Configuration |
SINGLE
|
SINGLE
|
DS Breakdown Voltage-Min |
15 V
|
15 V
|
Drain Current-Max (ID) |
4.5 A
|
1.3 A
|
FET Technology |
JUNCTION
|
JUNCTION
|
Highest Frequency Band |
X BAND
|
X BAND
|
JESD-30 Code |
R-CDFM-F2
|
R-CDFM-F2
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Mode |
DEPLETION MODE
|
DEPLETION MODE
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
FLANGE MOUNT
|
FLANGE MOUNT
|
Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
YES
|
YES
|
Terminal Form |
FLAT
|
FLAT
|
Terminal Position |
DUAL
|
DUAL
|
Transistor Element Material |
GALLIUM ARSENIDE
|
GALLIUM ARSENIDE
|
Base Number Matches |
4
|
4
|
|
|
|
Compare FLM7785-12F with alternatives
Compare FLM7785-4F with alternatives