FLM0910-4C
vs
FLM0910-12F
feature comparison
| Part Life Cycle Code |
Obsolete
|
Contact Manufacturer
|
| Ihs Manufacturer |
FUJITSU LTD
|
SUMITOMO ELECTRIC DEVICE INNOVATIONS USA INC
|
| Package Description |
HERMETIC SEALED, METAL CERAMIC PACKAGE-2
|
,
|
| Pin Count |
2
|
2
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.29.00.75
|
|
| Additional Feature |
HIGH RELIABILITY
|
|
| Case Connection |
SOURCE
|
|
| Configuration |
SINGLE
|
|
| DS Breakdown Voltage-Min |
15 V
|
|
| Drain Current-Max (ID) |
1.3 A
|
|
| FET Technology |
JUNCTION
|
|
| Highest Frequency Band |
X BAND
|
|
| JESD-30 Code |
R-CDFM-F2
|
|
| Number of Elements |
1
|
|
| Number of Terminals |
2
|
|
| Operating Mode |
DEPLETION MODE
|
|
| Operating Temperature-Max |
175 °C
|
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
FLANGE MOUNT
|
|
| Polarity/Channel Type |
N-CHANNEL
|
|
| Power Dissipation Ambient-Max |
25 W
|
|
| Qualification Status |
Not Qualified
|
|
| Surface Mount |
YES
|
|
| Terminal Form |
FLAT
|
|
| Terminal Position |
DUAL
|
|
| Transistor Element Material |
GALLIUM ARSENIDE
|
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Manufacturer Package Code |
|
CASE IB
|
|
|
|
Compare FLM0910-4C with alternatives
Compare FLM0910-12F with alternatives