FLIXF3208BEC0SE000
vs
DS26524G
feature comparison
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
INPHI CORP
|
MAXIM INTEGRATED PRODUCTS INC
|
Package Description |
BGA,
|
17 X 17 MM, 1 MM PITCH, TE-CSBGA-256
|
Reach Compliance Code |
compliant
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
Length |
17 mm
|
17 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
256
|
256
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.8 mm
|
1.76 mm
|
Supply Voltage-Nom |
1.8 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
BIPOLAR
|
Telecom IC Type |
FRAMER
|
TIME SLOT 0/16 TRANSCEIVER
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
17 mm
|
17 mm
|
Base Number Matches |
3
|
1
|
Pbfree Code |
|
No
|
Rohs Code |
|
No
|
Part Package Code |
|
BGA
|
Pin Count |
|
256
|
Carrier Type |
|
CEPT PCM-30/E-1
|
Carrier Type (2) |
|
T-1(DS1)
|
JESD-609 Code |
|
e0
|
Package Equivalence Code |
|
BGA256,16X16,40
|
Supply Current-Max |
|
0.45 mA
|
Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare FLIXF3208BEC0SE000 with alternatives
Compare DS26524G with alternatives