FEP30DP
vs
VS-60CPU02-F
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
VISHAY INTERTECHNOLOGY INC
|
VISHAY INTERTECHNOLOGY INC
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
|
| Application |
GENERAL PURPOSE
|
ULTRA FAST RECOVERY
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
0.95 V
|
1.1 V
|
| Operating Temperature-Max |
150 °C
|
175 °C
|
| Output Current-Max |
30 A
|
30 A
|
| Rep Pk Reverse Voltage-Max |
200 V
|
200 V
|
| Reverse Recovery Time-Max |
0.035 µs
|
0.036 µs
|
| Surface Mount |
NO
|
NO
|
| Base Number Matches |
8
|
2
|
| Package Description |
|
ROHS COMPLIANT, PLASTIC PACKAGE-3
|
| Samacsys Manufacturer |
|
Vishay
|
| Additional Feature |
|
FREE WHEELING DIODE, LOW LEAKAGE CURRENT
|
| Case Connection |
|
CATHODE
|
| Configuration |
|
COMMON CATHODE, 2 ELEMENTS
|
| Diode Element Material |
|
SILICON
|
| JEDEC-95 Code |
|
TO-247AC
|
| JESD-30 Code |
|
R-PSFM-T3
|
| Non-rep Pk Forward Current-Max |
|
300 A
|
| Number of Elements |
|
2
|
| Number of Phases |
|
1
|
| Number of Terminals |
|
3
|
| Operating Temperature-Min |
|
-65 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
FLANGE MOUNT
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Reverse Current-Max |
|
50 µA
|
| Terminal Form |
|
THROUGH-HOLE
|
| Terminal Position |
|
SINGLE
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
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