FEP30AP
vs
C25P10F
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
GENERAL SEMICONDUCTOR INC
|
NIHON INTER ELECTRONICS CORP
|
| Package Description |
PLASTIC, TO-3P, 3 PIN
|
R-PSFM-T3
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
8541.10.00.80
|
| Additional Feature |
LOW POWER LOSS
|
|
| Application |
EFFICIENCY
|
ULTRA FAST RECOVERY
|
| Case Connection |
CATHODE
|
CATHODE
|
| Configuration |
COMMON CATHODE, 2 ELEMENTS
|
COMMON CATHODE, 2 ELEMENTS
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
0.95 V
|
0.98 V
|
| JEDEC-95 Code |
TO-247AD
|
|
| JESD-30 Code |
R-PSFM-T3
|
R-PSFM-T3
|
| JESD-609 Code |
e0
|
|
| Non-rep Pk Forward Current-Max |
300 A
|
150 A
|
| Number of Elements |
2
|
2
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
3
|
3
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Output Current-Max |
30 A
|
25 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLANGE MOUNT
|
FLANGE MOUNT
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Rep Pk Reverse Voltage-Max |
50 V
|
100 V
|
| Reverse Recovery Time-Max |
0.035 µs
|
0.05 µs
|
| Surface Mount |
NO
|
NO
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Position |
SINGLE
|
SINGLE
|
| Base Number Matches |
2
|
2
|
| Part Package Code |
|
TO-3P
|
| Pin Count |
|
3
|
| Operating Temperature-Min |
|
-40 °C
|
| Reverse Current-Max |
|
25 µA
|
|
|
|
Compare FEP30AP with alternatives
Compare C25P10F with alternatives