FDZ206P
vs
FDMC7692
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
FAIRCHILD SEMICONDUCTOR CORP
Part Package Code
BGA
MLP
Package Description
ULTRA THIN, BGA-30
3.30 X 3.30 MM, ROHS COMPLIANT, MLP, 8 PIN
Pin Count
30
8
Reach Compliance Code
unknown
compliant
Configuration
SINGLE WITH BUILT-IN DIODE
SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min
20 V
30 V
Drain Current-Max (ID)
13 A
13.3 A
Drain-source On Resistance-Max
0.0095 Ω
0.0085 Ω
FET Technology
METAL-OXIDE SEMICONDUCTOR
METAL-OXIDE SEMICONDUCTOR
JESD-30 Code
R-PBGA-B30
S-PDSO-N5
Moisture Sensitivity Level
1
1
Number of Elements
1
1
Number of Terminals
30
5
Operating Mode
ENHANCEMENT MODE
ENHANCEMENT MODE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
SQUARE
Package Style
GRID ARRAY
SMALL OUTLINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
Polarity/Channel Type
P-CHANNEL
N-CHANNEL
Pulsed Drain Current-Max (IDM)
60 A
40 A
Qualification Status
COMMERCIAL
Not Qualified
Surface Mount
YES
YES
Terminal Finish
NOT SPECIFIED
NICKEL PALLADIUM GOLD
Terminal Form
BALL
NO LEAD
Terminal Position
BOTTOM
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
30
Transistor Application
SWITCHING
SWITCHING
Transistor Element Material
SILICON
SILICON
Base Number Matches
2
2
Manufacturer Package Code
8LD,MLP,DUAL, 3.3MM SQUARE
ECCN Code
EAR99
HTS Code
8541.29.00.95
Avalanche Energy Rating (Eas)
58 mJ
Case Connection
DRAIN
JESD-609 Code
e4
Operating Temperature-Max
150 °C
Power Dissipation-Max (Abs)
29 W
Compare FDZ206P with alternatives
Compare FDMC7692 with alternatives