FDB8445
vs
FDB9409-F085
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
End Of Life
|
Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
ONSEMI
|
Part Package Code |
D2PAK
|
TO-263 2L (D2PAK)
|
Package Description |
ROHS COMPLIANT PACKAGE-3
|
D2PAK-3/2
|
Pin Count |
3
|
|
Reach Compliance Code |
unknown
|
not_compliant
|
Avalanche Energy Rating (Eas) |
102 mJ
|
70 mJ
|
Case Connection |
DRAIN
|
DRAIN
|
Configuration |
SINGLE WITH BUILT-IN DIODE
|
SINGLE WITH BUILT-IN DIODE
|
DS Breakdown Voltage-Min |
40 V
|
40 V
|
Drain Current-Max (ID) |
70 A
|
80 A
|
Drain-source On Resistance-Max |
0.009 Ω
|
0.0035 Ω
|
FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
JEDEC-95 Code |
TO-263AB
|
TO-263AB
|
JESD-30 Code |
R-PSSO-G2
|
R-PSSO-G2
|
JESD-609 Code |
e3
|
e3
|
Moisture Sensitivity Level |
1
|
1
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
260
|
245
|
Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
Qualification Status |
COMMERCIAL
|
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
MATTE TIN
|
Matte Tin (Sn) - annealed
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Position |
SINGLE
|
SINGLE
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Transistor Application |
SWITCHING
|
SWITCHING
|
Transistor Element Material |
SILICON
|
SILICON
|
Base Number Matches |
3
|
1
|
Manufacturer Package Code |
|
418AJ
|
ECCN Code |
|
EAR99
|
Samacsys Manufacturer |
|
onsemi
|
Operating Temperature-Max |
|
175 °C
|
Operating Temperature-Min |
|
-55 °C
|
Power Dissipation-Max (Abs) |
|
94 W
|
Reference Standard |
|
AEC-Q101
|
Turn-off Time-Max (toff) |
|
50 ns
|
Turn-on Time-Max (ton) |
|
193 ns
|
|
|
|
Compare FDB8445 with alternatives
Compare FDB9409-F085 with alternatives