FAN7527BN vs KA7526 feature comparison

FAN7527BN Rochester Electronics LLC

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KA7526 Samsung Semiconductor

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS INC SAMSUNG SEMICONDUCTOR INC
Part Package Code DIP DIP
Package Description DIP, DIP, DIP8,.3
Pin Count 8 8
Reach Compliance Code unknown compliant
Analog IC - Other Type POWER FACTOR AND FLUORESCENT LIGHT CONTROLLER POWER FACTOR CONTROLLER
Control Mode CURRENT-MODE CURRENT-MODE
Control Technique PULSE WIDTH MODULATION PULSE WIDTH MODULATION
Input Voltage-Max 25 V 30 V
Input Voltage-Min 9.5 V 9 V
Input Voltage-Nom 14 V 12 V
JESD-30 Code R-PDIP-T8 R-PDIP-T8
JESD-609 Code e3 e0
Length 9.2 mm 9.2 mm
Moisture Sensitivity Level NOT APPLICABLE
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -25 °C
Output Current-Max 0.5 A 0.5 A
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT APPLICABLE
Seated Height-Max 5.08 mm 5.08 mm
Surface Mount NO NO
Switcher Configuration SINGLE SINGLE
Temperature Grade OTHER OTHER
Terminal Finish MATTE TIN TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT APPLICABLE
Width 7.62 mm 7.62 mm
Base Number Matches 1 2
ECCN Code EAR99
HTS Code 8542.39.00.01
Package Equivalence Code DIP8,.3
Qualification Status Not Qualified
Technology BIPOLAR