FA80386EXTB25
vs
PACE1757M-35QLC
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEL CORP
|
PERFORMANCE SEMICONDUCTOR CORP
|
Part Package Code |
QFP
|
QFP
|
Package Description |
LFQFP, QFP144,.87SQ,20
|
QFF,
|
Pin Count |
144
|
144
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
26
|
40
|
Bit Size |
32
|
16
|
Boundary Scan |
YES
|
NO
|
Clock Frequency-Max |
25 MHz
|
35 MHz
|
External Data Bus Width |
16
|
16
|
Format |
FIXED POINT
|
FLOATING POINT
|
Integrated Cache |
NO
|
NO
|
JESD-30 Code |
S-PQFP-G144
|
S-PQFP-F144
|
JESD-609 Code |
e0
|
|
Length |
20 mm
|
29.21 mm
|
Low Power Mode |
YES
|
YES
|
Number of DMA Channels |
2
|
1
|
Number of External Interrupts |
12
|
8
|
Number of Serial I/Os |
3
|
|
Number of Terminals |
144
|
144
|
Operating Temperature-Max |
117 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFQFP
|
QFF
|
Package Equivalence Code |
QFP144,.87SQ,20
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
FLATPACK
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (words) |
0
|
0
|
Seated Height-Max |
1.7 mm
|
3.556 mm
|
Speed |
25 MHz
|
35 MHz
|
Supply Current-Max |
140 mA
|
325 mA
|
Supply Voltage-Max |
3.6 V
|
5.5 V
|
Supply Voltage-Min |
3 V
|
4.5 V
|
Supply Voltage-Nom |
3.3 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
GULL WING
|
FLAT
|
Terminal Pitch |
0.5 mm
|
0.6 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
20 mm
|
29.21 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
Base Number Matches |
2
|
1
|
ECCN Code |
|
3A991.A.2
|
On Chip Data RAM Width |
|
|
|
|
|
Compare FA80386EXTB25 with alternatives
Compare PACE1757M-35QLC with alternatives