FA80386EXTB20
vs
79RC32V364100DAI
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
INTEL CORP
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Package Description |
LFQFP,
|
LFQFP, QFP144,.87SQ,20
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
26
|
32
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
40 MHz
|
100 MHz
|
| External Data Bus Width |
16
|
32
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
NO
|
YES
|
| JESD-30 Code |
S-PQFP-G144
|
S-PQFP-G144
|
| Length |
20 mm
|
20 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of DMA Channels |
2
|
|
| Number of External Interrupts |
12
|
|
| Number of Serial I/Os |
3
|
|
| Number of Terminals |
144
|
144
|
| On Chip Data RAM Width |
|
|
| Operating Temperature-Max |
118 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFQFP
|
LFQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (words) |
0
|
|
| Seated Height-Max |
1.7 mm
|
1.6 mm
|
| Speed |
20 MHz
|
100 MHz
|
| Supply Current-Max |
110 mA
|
300 mA
|
| Supply Voltage-Max |
3.6 V
|
3.465 V
|
| Supply Voltage-Min |
2.7 V
|
3.135 V
|
| Supply Voltage-Nom |
3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
20 mm
|
20 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
1
|
6
|
| Pbfree Code |
|
No
|
| Rohs Code |
|
No
|
| Part Package Code |
|
QFP
|
| Pin Count |
|
144
|
| JESD-609 Code |
|
e0
|
| Moisture Sensitivity Level |
|
3
|
| Package Equivalence Code |
|
QFP144,.87SQ,20
|
| Peak Reflow Temperature (Cel) |
|
240
|
| Terminal Finish |
|
TIN LEAD
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare FA80386EXTB20 with alternatives
Compare 79RC32V364100DAI with alternatives