F2GFF4
vs
TSD2GM4G
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
YANGZHOU YANGJIE ELECTRONICS CO LTD
|
TAIWAN SEMICONDUCTOR CO LTD
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.80
|
8541.10.00.80
|
Additional Feature |
FREE WHEELING DIODE
|
HIGH SURGE CURRENT CAPABILITY
|
Application |
FAST RECOVERY
|
GENERAL PURPOSE
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
Forward Voltage-Max (VF) |
1.3 V
|
1 V
|
JESD-30 Code |
R-PDSO-F2
|
R-PDSO-C2
|
Non-rep Pk Forward Current-Max |
50 A
|
50 A
|
Number of Elements |
1
|
1
|
Number of Phases |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
150 °C
|
175 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Output Current-Max |
2 A
|
2 A
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Rep Pk Reverse Voltage-Max |
400 V
|
400 V
|
Reverse Current-Max |
5 µA
|
1 µA
|
Reverse Recovery Time-Max |
0.15 µs
|
|
Reverse Test Voltage |
400 V
|
|
Surface Mount |
YES
|
YES
|
Terminal Form |
FLAT
|
C BEND
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
1
|
1
|
Package Description |
|
SMB, 2 PIN
|
JEDEC-95 Code |
|
DO-214AA
|
JESD-609 Code |
|
e3
|
Moisture Sensitivity Level |
|
1
|
Peak Reflow Temperature (Cel) |
|
250
|
Reference Standard |
|
IEC-61000-4-2
|
Terminal Finish |
|
MATTE TIN
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare F2GFF4 with alternatives
Compare TSD2GM4G with alternatives