F25L16PA-50PG2S vs W25Q16CVSSAP feature comparison

F25L16PA-50PG2S Elite Semiconductor Memory Technology Inc

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W25Q16CVSSAP Winbond Electronics Corp

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC WINBOND ELECTRONICS CORP
Part Package Code SOIC SOIC
Package Description SOP, SOP, SOP8,.3
Pin Count 8 8
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 50 MHz 80 MHz
JESD-30 Code R-PDSO-G8 S-PDSO-G8
Length 4.9 mm 5.28 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 105 °C
Operating Temperature-Min -40 °C -40 °C
Organization 2MX8 2MX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP8,.25 SOP8,.3
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial SERIAL SERIAL
Programming Voltage 2.7 V 3 V
Seated Height-Max 1.75 mm 2.16 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Type NOR TYPE NOR TYPE
Width 3.9 mm 5.28 mm
Write Protection HARDWARE/SOFTWARE HARDWARE/SOFTWARE
Base Number Matches 1 1
Rohs Code Yes
Data Retention Time-Min 20
Endurance 100000 Write/Erase Cycles
Qualification Status Not Qualified
Serial Bus Type SPI
Standby Current-Max 0.000005 A
Supply Current-Max 0.025 mA

Compare F25L16PA-50PG2S with alternatives

Compare W25Q16CVSSAP with alternatives