F25L16PA-50DG
vs
SST25VF016B-50-4I-QAF
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Contact Manufacturer
Transferred
Ihs Manufacturer
ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC
SILICON STORAGE TECHNOLOGY INC
Part Package Code
DIP
SON
Package Description
DIP, DIP8,.3
6 X 5 MM, ROHS COMPLIANT, WSON-8
Pin Count
8
8
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
50 MHz
50 MHz
Data Retention Time-Min
20
100
Endurance
100000 Write/Erase Cycles
100000 Write/Erase Cycles
JESD-30 Code
R-PDIP-T8
R-PDSO-N8
Length
9.27 mm
6 mm
Memory Density
16777216 bit
16777216 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
2MX8
2MX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
DIP
HVSON
Package Equivalence Code
DIP8,.3
SOLCC8,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE, VERY THIN PROFILE
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Programming Voltage
3 V
3 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5 mm
0.8 mm
Serial Bus Type
SPI
SPI
Standby Current-Max
0.00003 A
0.00002 A
Supply Current-Max
0.035 mA
0.02 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
THROUGH-HOLE
NO LEAD
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Type
NOR TYPE
NOR TYPE
Width
7.62 mm
5 mm
Write Protection
HARDWARE/SOFTWARE
HARDWARE/SOFTWARE
Base Number Matches
1
2
JESD-609 Code
e4
Terminal Finish
NICKEL PALLADIUM GOLD
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