F25L16PA-100HG2S
vs
SST26VF016B-104V/SM70SVAO
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
SON
Package Description
HVSON,
SOIC-8
Pin Count
8
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
3A991.B.1.A
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
100 MHz
104 MHz
JESD-30 Code
R-PDSO-N8
R-PDSO-G8
Length
6 mm
5.26 mm
Memory Density
16777216 bit
16777216 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
1
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
2097152 words
16777216 words
Number of Words Code
2000000
16000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
105 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
2MX8
16MX1
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVSON
SOP
Package Equivalence Code
SOLCC8,.25
SOP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
SMALL OUTLINE
Parallel/Serial
SERIAL
SERIAL
Programming Voltage
2.7 V
3 V
Seated Height-Max
0.8 mm
2.03 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Type
NOR TYPE
NOR TYPE
Width
5 mm
5.25 mm
Write Protection
HARDWARE/SOFTWARE
HARDWARE/SOFTWARE
Base Number Matches
1
1
Data Retention Time-Min
100
Endurance
100000 Write/Erase Cycles
Number of Ports
1
Screening Level
AEC-Q100; TS 16949
Serial Bus Type
SPI
Standby Current-Max
0.000045 A
Supply Current-Max
0.025 mA
Compare F25L16PA-100HG2S with alternatives
Compare SST26VF016B-104V/SM70SVAO with alternatives