F11C70DC
vs
MC1690L
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
FAIRCHILD SEMICONDUCTOR CORP
MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code
DIP
Package Description
DIP,
DIP, DIP16,.3
Pin Count
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Family
ECL
JESD-30 Code
R-GDIP-T16
R-XDIP-T16
Length
19.56 mm
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Number of Bits
1
Number of Functions
1
2
Number of Terminals
16
16
Operating Temperature-Max
75 °C
85 °C
Operating Temperature-Min
-30 °C
Output Characteristics
OPEN-EMITTER
Output Polarity
COMPLEMENTARY
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Power Supply Current-Max (ICC)
48 mA
59 mA
Propagation Delay (tpd)
1.4 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
Surface Mount
NO
NO
Technology
ECL
ECL
Temperature Grade
COMMERCIAL EXTENDED
OTHER
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
MASTER-SLAVE
Width
7.62 mm
fmax-Min
550 MHz
Base Number Matches
1
3
Rohs Code
JESD-609 Code
e0
Max Frequency@Nom-Sup
500000000 Hz
Package Equivalence Code
DIP16,.3
Terminal Finish
Tin/Lead (Sn/Pb)
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