F10231DC
vs
10573/BFAJC
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
FAIRCHILD SEMICONDUCTOR CORP
|
MOTOROLA INC
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP, DIP16,.3
|
DFP, FL16,.3
|
| Pin Count |
16
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
WITH ADDITIONAL COMMON LATCH ENABLE
|
FOUR 2:1 MUX FOLLOWED BY LATCH
|
| Family |
10K
|
10K
|
| JESD-30 Code |
R-GDIP-T16
|
R-GDFP-F16
|
| JESD-609 Code |
e0
|
e0
|
| Length |
19.558 mm
|
9.65 mm
|
| Logic IC Type |
D FLIP-FLOP
|
D LATCH
|
| Number of Bits |
1
|
4
|
| Number of Functions |
2
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
75 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Output Characteristics |
OPEN-EMITTER
|
OPEN-EMITTER
|
| Output Polarity |
COMPLEMENTARY
|
TRUE
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DFP
|
| Package Equivalence Code |
DIP16,.3
|
FL16,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
FLATPACK
|
| Power Supply Current-Max (ICC) |
65 mA
|
73 mA
|
| Propagation Delay (tpd) |
3.3 ns
|
7.5 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
2.15 mm
|
| Surface Mount |
NO
|
YES
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
FLAT
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Trigger Type |
POSITIVE EDGE
|
LOW LEVEL
|
| Width |
7.62 mm
|
6.415 mm
|
| fmax-Min |
200 MHz
|
|
| Base Number Matches |
1
|
3
|
| Number of Inputs |
|
2
|
| Prop. Delay@Nom-Sup |
|
7.5 ns
|
| Screening Level |
|
38535Q/M;38534H;883B
|
|
|
|
Compare F10231DC with alternatives
Compare 10573/BFAJC with alternatives