F100131FC
vs
100331DMQB
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
NATIONAL SEMICONDUCTOR CORP
Package Description
QFF, QFL24,.4SQ
DIP, DIP24,.4
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-XQFP-F24
R-GDIP-T24
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Number of Functions
3
3
Number of Terminals
24
24
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
CERAMIC
CERAMIC, GLASS-SEALED
Package Code
QFF
DIP
Package Equivalence Code
QFL24,.4SQ
DIP24,.4
Package Shape
SQUARE
RECTANGULAR
Package Style
FLATPACK
IN-LINE
Power Supply Current-Max (ICC)
149 mA
130 mA
Prop. Delay@Nom-Sup
2.4 ns
2.5 ns
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
NO
Technology
ECL
ECL
Temperature Grade
OTHER
MILITARY
Terminal Form
FLAT
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
QUAD
DUAL
Trigger Type
MASTER-SLAVE
POSITIVE EDGE
Base Number Matches
3
5
Additional Feature
WITH ADDITIONAL COMMON CLOCK, SET AND RESET INPUTS; OPTEMP SPECIFIED AS TC
Family
100K
JESD-609 Code
e0
Load Capacitance (CL)
3 pF
Max Frequency@Nom-Sup
400000000 Hz
Number of Bits
1
Output Characteristics
OPEN-EMITTER
Output Polarity
COMPLEMENTARY
Propagation Delay (tpd)
2.4 ns
Screening Level
MIL-STD-883 Class B
Seated Height-Max
5.72 mm
Terminal Finish
TIN LEAD
Width
10.16 mm
fmax-Min
400 MHz
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