EZR32WG330F256R67G
vs
EZR32WG330F256R67G-C0
feature comparison
Part Life Cycle Code |
End Of Life
|
End Of Life
|
Ihs Manufacturer |
SILICON LABORATORIES INC
|
SILICON LABORATORIES INC
|
Package Description |
HVQCCN,
|
HVQCCN,
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
YES
|
YES
|
Address Bus Width |
|
|
Bit Size |
32
|
32
|
Boundary Scan |
NO
|
NO
|
CPU Family |
CORTEX-M4
|
CORTEX-M4
|
Clock Frequency-Max |
32 MHz
|
48 MHz
|
DAC Channels |
YES
|
YES
|
DMA Channels |
YES
|
YES
|
External Data Bus Width |
|
|
Format |
FIXED POINT
|
FIXED POINT
|
Integrated Cache |
NO
|
NO
|
JESD-30 Code |
S-XQCC-N64
|
S-XQCC-N64
|
Length |
9 mm
|
9 mm
|
Low Power Mode |
YES
|
YES
|
Number of External Interrupts |
16
|
|
Number of I/O Lines |
38
|
38
|
Number of Serial I/Os |
7
|
6
|
Number of Terminals |
64
|
64
|
Number of Timers |
7
|
6
|
On Chip Data RAM Width |
8
|
8
|
On Chip Program ROM Width |
8
|
8
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
PWM Channels |
YES
|
YES
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Equivalence Code |
LCC64,.35SQ,20
|
LCC64,.35SQ,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
RAM (bytes) |
32768
|
32768
|
ROM (words) |
262144
|
262144
|
ROM Programmability |
FLASH
|
FLASH
|
Seated Height-Max |
0.9 mm
|
0.9 mm
|
Speed |
48 MHz
|
48 MHz
|
Supply Voltage-Max |
3.8 V
|
3.8 V
|
Supply Voltage-Min |
3 V
|
3 V
|
Supply Voltage-Nom |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
9 mm
|
9 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
Base Number Matches |
5
|
2
|
Rohs Code |
|
Yes
|
Date Of Intro |
|
2019-11-15
|
JESD-609 Code |
|
e3
|
Moisture Sensitivity Level |
|
2
|
Peak Reflow Temperature (Cel) |
|
260
|
Terminal Finish |
|
Matte Tin (Sn)
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare EZR32WG330F256R67G with alternatives
Compare EZR32WG330F256R67G-C0 with alternatives