EZR32LG230FE55G
vs
CC1310F128RGZT
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
SILICON LABORATORIES INC
TEXAS INSTRUMENTS INC
Package Description
HVQCCN,
HVQCCN,
Reach Compliance Code
unknown
compliant
HTS Code
8542.31.00.01
8542.31.00.01
JESD-30 Code
S-XQCC-N64
S-PQCC-N48
Length
9 mm
7 mm
Number of Terminals
64
48
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
HVQCCN
HVQCCN
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Seated Height-Max
0.9 mm
1 mm
Supply Voltage-Max
3.8 V
3.8 V
Supply Voltage-Min
1.98 V
1.8 V
Supply Voltage-Nom
3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Width
9 mm
7 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR CIRCUIT
MICROPROCESSOR CIRCUIT
Base Number Matches
1
1
Pbfree Code
Rohs Code
ECCN Code
5A992.C
Samacsys Manufacturer
Texas Instruments
CPU Family
CORTEX-M3
JESD-609 Code
e4
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
RAM (bytes)
28672
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s)
30
Compare EZR32LG230FE55G with alternatives
Compare CC1310F128RGZT with alternatives