EXBV8V824JV vs BCN164ABI824J13 feature comparison

EXBV8V824JV Panasonic Electronic Components

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BCN164ABI824J13 TT electronics / BI Technologies

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer PANASONIC CORP BI TECHNOLOGIES CORP
Package Description CHIP SMT, 1206
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
Factory Lead Time 18 Weeks
Construction Rectangular Rectangular
Element Power Dissipation 0.063 W 0.063 W
First Element Resistance 820000 Ω 820000 Ω
JESD-609 Code e3 e3
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Network Type ISOLATED ISOLATED
Number of Elements 1 1
Number of Functions 4 4
Number of Terminals 8 8
Operating Temperature-Max 125 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.6 mm 0.6 mm
Package Length 3.2 mm 3.2 mm
Package Shape RECTANGULAR PACKAGE RECTANGULAR PACKAGE
Package Style SMT SMT
Package Width 1.6 mm 1.6 mm
Packing Method TR, PUNCHED, 7 INCH TR, Paper, 13 Inch
Rated Temperature 70 °C 70 °C
Reference Standard IEC60115-9
Resistance 820000 Ω 820000 Ω
Resistor Type ARRAY/NETWORK RESISTOR ARRAY/NETWORK RESISTOR
Second/Last Element Resistance 820000 Ω 820000 Ω
Size Code 0612 1206
Surface Mount YES YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 200 ppm/°C 200 ppm/°C
Terminal Finish MATTE TIN OVER NICKEL Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 5% 5%
Working Voltage 50 V 50 V
Base Number Matches 1 1
HTS Code 8533.21.00.20
Rated Power Dissipation (P) 0.063 W

Compare EXBV8V824JV with alternatives

Compare BCN164ABI824J13 with alternatives