EXBA10E823J vs RAC648N82K5%R feature comparison

EXBA10E823J Panasonic Electronic Components

Buy Now Datasheet

RAC648N82K5%R SEI Stackpole Electronics Inc

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer PANASONIC CORP STACKPOLE ELECTRONICS INC
Package Description CHIP
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.20
Construction Rectangular Chip
Element Power Dissipation 0.063 W
First Element Resistance 82000 Ω
JESD-609 Code e3
Mounting Feature SURFACE MOUNT
Network Type BUSSED BUSSED
Number of Elements 8
Number of Functions 1
Number of Terminals 10 10
Operating Temperature-Max 125 °C 150 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.55 mm 0.6 mm
Package Length 6.4 mm 6.4 mm
Package Shape RECTANGULAR PACKAGE
Package Style SMT SMT
Package Width 3.1 mm 3.1 mm
Packing Method TR, EMBOSSED, 7 INCH Tape, Embossed
Rated Temperature 70 °C
Reference Standard IEC60115-9
Resistance 82000 Ω 82000 Ω
Resistor Type ARRAY/NETWORK RESISTOR ARRAY/NETWORK RESISTOR
Second/Last Element Resistance 82000 Ω
Size Code 2512 2512
Surface Mount YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 200 ppm/°C 200 ppm/°C
Terminal Finish Tin (Sn)
Terminal Shape WRAPAROUND
Tolerance 5% 5%
Working Voltage 50 V 50 V
Base Number Matches 1 1
Rated Power Dissipation (P) 0.063 W

Compare EXBA10E823J with alternatives

Compare RAC648N82K5%R with alternatives