EXB38V303JV
vs
MNR14E0ABJ303
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Yes
Rohs Code
Yes
Yes
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
PANASONIC CORP
ROHM CO LTD
Package Description
CHIP
CHIP
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
Factory Lead Time
18 Weeks
Additional Feature
IEC60115-9
Construction
Rectangular
Chip
Element Power Dissipation
0.063 W
First Element Resistance
30000 Ω
30000 Ω
JESD-609 Code
e3
e3
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Network Type
ISOLATED
ISOLATED
Number of Elements
1
1
Number of Functions
4
4
Number of Terminals
8
8
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.5 mm
0.5 mm
Package Length
3.2 mm
3.2 mm
Package Shape
RECTANGULAR PACKAGE
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Package Width
1.6 mm
1.6 mm
Packing Method
TR, PUNCHED, 7 INCH
TR, PAPER, 7 INCH
Rated Temperature
70 °C
70 °C
Reference Standard
AEC-Q200
Resistance
30000 Ω
30000 Ω
Resistor Type
ARRAY/NETWORK RESISTOR
ARRAY/NETWORK RESISTOR
Second/Last Element Resistance
30000 Ω
Size Code
0612
0612
Surface Mount
YES
YES
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
200 ppm/°C
200 ppm/°C
Terminal Finish
Matte Tin (Sn) - with Nickel (Ni) barrier
Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape
WRAPAROUND
WRAPAROUND
Tolerance
5%
5%
Working Voltage
50 V
50 V
Base Number Matches
1
1
HTS Code
8533.21.00.20
Manufacturer Series
MNR14
Rated Power Dissipation (P)
0.063 W
Series
MNR14
Compare EXB38V303JV with alternatives
Compare MNR14E0ABJ303 with alternatives