EWIXP460ABT vs GWIXP460AE feature comparison

EWIXP460ABT Intel Corporation

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GWIXP460AE Intel Corporation

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEL CORP INTEL CORP
Part Package Code BGA BGA
Package Description HBGA, BGA544,26X26,50 BGA, BGA544,26X26,50
Pin Count 544 544
Reach Compliance Code compliant compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Boundary Scan YES YES
Clock Frequency-Max 66 MHz 66 MHz
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B544 S-PBGA-B544
JESD-609 Code e1 e0
Length 35 mm 35 mm
Low Power Mode NO NO
Number of Terminals 544 544
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HBGA BGA
Package Equivalence Code BGA544,26X26,50 BGA544,26X26,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG GRID ARRAY, HEAT SINK/SLUG
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.51 mm 2.51 mm
Speed 266 MHz 667 MHz
Supply Voltage-Max 1.365 V 1.47 V
Supply Voltage-Min 1.235 V 1.33 V
Supply Voltage-Nom 1.3 V 1.4 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 35 mm 35 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1

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