EWIXP460ABT
vs
EWIXP460AAD
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEL CORP
INTEL CORP
Part Package Code
BGA
BGA
Package Description
HBGA, BGA544,26X26,50
BGA,
Pin Count
544
544
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Boundary Scan
YES
YES
Clock Frequency-Max
66 MHz
66 MHz
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B544
S-PBGA-B544
JESD-609 Code
e1
e1
Length
35 mm
35 mm
Low Power Mode
NO
NO
Number of Terminals
544
544
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HBGA
BGA
Package Equivalence Code
BGA544,26X26,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, HEAT SINK/SLUG
GRID ARRAY, HEAT SINK/SLUG
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.51 mm
2.51 mm
Speed
266 MHz
533 MHz
Supply Voltage-Max
1.365 V
1.365 V
Supply Voltage-Min
1.235 V
1.235 V
Supply Voltage-Nom
1.3 V
1.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
35 mm
35 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
1
Additional Feature
ALSO REQUIRES 3.3V SUPPLY
Address Bus Width
32
External Data Bus Width
32
Compare EWIXP460ABT with alternatives
Compare EWIXP460AAD with alternatives