ET2716Q vs MBM2716 feature comparison

ET2716Q Thales Group

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MBM2716 FUJITSU Semiconductor Limited

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer THOMSON-CSF SEMICONDUCTORS FUJITSU SEMICONDUCTOR AMERICA INC
Part Package Code DIP
Package Description CERAMIC, DIP-24 DIP,
Pin Count 24
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 450 ns 450 ns
JESD-30 Code R-GDIP-T24 R-CDIP-T24
Memory Density 16384 bit 16384 bit
Memory IC Type UVPROM UVPROM CARD
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 2048 words 2048 words
Number of Words Code 2000 2000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 2KX8 2KX8
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.25 V 5.25 V
Supply Voltage-Min (Vsup) 4.75 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology NMOS NMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 4 2
Package Code DIP
Supply Current-Max 0.025 mA

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