ESR25JZPF31R6 vs MR10X31R6FBL feature comparison

ESR25JZPF31R6 ROHM Semiconductor

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MR10X31R6FBL Walsin Technology Corporation

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer ROHM CO LTD WALSIN TECHNOLOGY CORP
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
Construction Chip Chip
JESD-609 Code e3 e3
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.55 mm 0.55 mm
Package Length 3.2 mm 3.1 mm
Package Style SMT SMT
Package Width 2.5 mm 2.6 mm
Packing Method TR, Embossed, 7 Inch BULK
Rated Power Dissipation (P) 0.5 W 0.5 W
Reference Standard AEC-Q200 AEC-Q200; MIL-STD-202
Resistance 31.6 Ω 31.6 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 1210 1210
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Finish TIN OVER NICKEL TIN
Tolerance 1% 1%
Working Voltage 200 V 200 V
Base Number Matches 1 1
Package Description CHIP
HTS Code 8533.21.00.30
Additional Feature ANTI-SULFUR, RATED AC VOLTAGE (V): 200
Mounting Feature SURFACE MOUNT
Rated Temperature 70 °C
Surface Mount YES
Terminal Shape WRAPAROUND

Compare ESR25JZPF31R6 with alternatives

Compare MR10X31R6FBL with alternatives