ESR25JZPD1213 vs AF1210DR-07121KL feature comparison

ESR25JZPD1213 ROHM Semiconductor

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AF1210DR-07121KL YAGEO Corporation

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer ROHM CO LTD YAGEO CORP
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
Construction Chip Rectangular
JESD-609 Code e3 e3
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.55 mm 0.57 mm
Package Length 3.2 mm 3.1 mm
Package Style SMT SMT
Package Width 2.5 mm 2.6 mm
Packing Method TR, Embossed, 7 Inch TR, PAPER, 7 INCH
Rated Power Dissipation (P) 0.5 W 0.5 W
Reference Standard AEC-Q200 AEC-Q200
Resistance 121000 Ω 121000 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 1210 1210
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier Matte Tin (Sn) - with Nickel (Ni) barrier
Tolerance 0.5% 0.5%
Working Voltage 200 V 200 V
Base Number Matches 1 1
Package Description CHIP
HTS Code 8533.21.00.30
Additional Feature ANTI-SULFUR
Mounting Feature SURFACE MOUNT
Rated Temperature 70 °C
Surface Mount YES
Terminal Shape WRAPAROUND

Compare ESR25JZPD1213 with alternatives

Compare AF1210DR-07121KL with alternatives