ESR18EZPF3304 vs HP06W2F3304T5E feature comparison

ESR18EZPF3304 ROHM Semiconductor

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HP06W2F3304T5E Royal Electronic Factory (Thailand) Co Ltd

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active Active
Ihs Manufacturer ROHM CO LTD ROYAL ELECTRONIC FTY CO LTD
Package Description CHIP CHIP
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30 8533.21.00.30
Additional Feature LASER TRIMMABLE, STANDARD: TS 16949
Construction Chip Rectangular
JESD-609 Code e3 e3
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.55 mm 0.55 mm
Package Length 3.2 mm 3.1 mm
Package Shape RECTANGULAR PACKAGE
Package Style SMT SMT
Package Width 1.6 mm 1.55 mm
Packing Method TR, PAPER, 7 INCH TR, PAPER, 7 INCH
Rated Power Dissipation (P) 0.5 W 0.5 W
Rated Temperature 70 °C 70 °C
Reference Standard AEC-Q200 AEC-Q200
Resistance 3300000 Ω 3300000 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 1206 1206
Surface Mount YES YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Finish TIN OVER NICKEL MATTE TIN OVER NICKEL
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 1% 1%
Working Voltage 200 V 200 V
Base Number Matches 1 1

Compare ESR18EZPF3304 with alternatives

Compare HP06W2F3304T5E with alternatives