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ESR18EZPF3013 vs MCR18EZHF3013 feature comparison

ESR18EZPF3013 ROHM Semiconductor

Buy Now Datasheet

MCR18EZHF3013 ROHM Semiconductor

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROHM CO LTD ROHM CO LTD
Reach Compliance Code compliant compliant
ECCN Code EAR99
Construction Chip Rectangular
JESD-609 Code e3 e3
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.55 mm 0.55 mm
Package Length 3.2 mm 3.2 mm
Package Style SMT SMT
Package Width 1.6 mm 1.6 mm
Packing Method TR, Paper, 7 Inch TR, PAPER, 7 INCH
Rated Power Dissipation (P) 0.33 W 0.25 W
Reference Standard AEC-Q200
Resistance 301000 Ω 301000 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 1206 1206
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Finish TIN OVER NICKEL Tin (Sn) - with Nickel (Ni) barrier
Tolerance 1% 1%
Working Voltage 200 V 200 V
Base Number Matches 1 1
Package Description CHIP
Mounting Feature SURFACE MOUNT
Package Shape RECTANGULAR PACKAGE
Rated Temperature 70 °C
Surface Mount YES
Terminal Shape WRAPAROUND
Resistors » Metal Glaze/Thick Film Resistors
Resistors » Metal Glaze/Thick Film Resistors

Compare ESR18EZPF3013 with alternatives

Compare MCR18EZHF3013 with alternatives