ESR18EZPF25R5 vs RPC1206FG25R5 feature comparison

ESR18EZPF25R5 ROHM Semiconductor

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RPC1206FG25R5 SEI Stackpole Electronics Inc

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer ROHM CO LTD STACKPOLE ELECTRONICS INC
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
Construction Chip Rectangular
JESD-609 Code e3 e3
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.55 mm 0.55 mm
Package Length 3.2 mm 3.1 mm
Package Style SMT SMT
Package Width 1.6 mm 1.55 mm
Packing Method TR, Paper, 7 Inch TR, PAPER, 10 INCH
Rated Power Dissipation (P) 0.33 W 0.33 W
Reference Standard AEC-Q200 AEC-Q200
Resistance 25.5 Ω 25.5 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 1206 1206
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Finish TIN OVER NICKEL Matte Tin (Sn) - with Nickel (Ni) barrier
Tolerance 1% 1%
Working Voltage 200 V 200 V
Base Number Matches 1 1
Package Description CHIP
HTS Code 8533.21.00.30
Mounting Feature SURFACE MOUNT
Rated Temperature 70 °C
Surface Mount YES
Terminal Shape WRAPAROUND

Compare ESR18EZPF25R5 with alternatives

Compare RPC1206FG25R5 with alternatives